Datasheet

AD9559 Data Sheet
Rev. C | Page 120 of 120
OUTLINE DIMENSIONS
Figure 57. 72-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
10 mm × 10 mm Body, Very Thin Quad
(CP-72-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
AD9559BCPZ −40°C to +85°C 72-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-72-4
AD9559BCPZ-REEL7 −40°C to +85°C 72-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-72-4
AD9559/PCBZ −40°C to +85°C Evaluation Board CP-72-4
1
Z = RoHS Compliant Part.
I
2
C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
COMPLIANT TO JEDEC STANDARDS MO-220-VNND-4
0.20 REF
0.80 MAX
0.65 TYP
1.00
0.85
0.80
0.05 MAX
0.02 NOM
1
18
54
37
19
36
7255
0.50
0.40
0.30
8.50 REF
PIN 1
INDICATOR
SEATING
PLANE
12° MAX
0.60
0.42
0.24
0.60
0.42
0.24
0.30
0.23
0.18
0.50
BSC
PIN 1
INDICATOR
COPLANARITY
0.08
06-25-2012-A
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
TOP VIEW
EXPOSED
PA D
BOTTOM VIEW
10.10
10.00 SQ
9.90
9.85
9.75 SQ
9.65
0.25 MIN
7.25
7.10 SQ
6.95
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registered trademarks are the property of their respective owners.
D10644-0-5/13(C)