Datasheet

AD9558 Data Sheet
Rev. B | Page 104 of 104
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4
0.25 MIN
1
64
16
17
49
48
32
33
0.50
0.40
0.30
0.50
BSC
0.20 REF
12° MAX
0.80 MAX
0.65 TYP
1.00
0.85
0.80
7.50 REF
0.05 MAX
0.02 NOM
0.60 MAX
0.60
MAX
SEATING
PLANE
PIN 1
INDICATOR
5.25
5.10 SQ
4.95
PIN 1
INDICATOR
0.30
0.23
0.18
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
TOP VIEW
EXPOSED
PAD
BOTTOM VIEW
9.10
9.00 SQ
8.90
8.85
8.75 SQ
8.65
06-14-2012-A
Figure 58. 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
9 mm × 9 mm Body, Very Thin Quad
(CP-64-5)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
AD9558BCPZ −40°C to +85°C 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-64-5
AD9558BCPZ-REEL7 −40°C to +85°C 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-64-5
AD9558/PCBZ −40°C to +85°C Evaluation Board CP-64-5
1
Z = RoHS Compliant Part.
I
2
C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
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D09758-0-6/13(B)