Datasheet

AD9557 Data Sheet
Rev. B | Page 92 of 92
OUTLINE DIMENSIONS
1
40
10
11
31
30
21
20
COMPLIANT TO JEDEC STANDARDS MO-220-VJJD-2
06-04-2012-A
0.50
BSC
P
I
N
1
I
N
D
I
C
A
T
O
R
4.50 REF
0.25 MIN
0.50
0.40
0.30
TOP VIEW
12° MAX
0.80 MAX
0.65 TYP
SEATING
PLANE
COPLANARITY
0.08
1.00
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
4.65
4.50 SQ
4.35
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
6.10
6.00 SQ
5.90
5.85
5.75 SQ
5.65
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
EXPOSED
PAD
(BOTTOM VIEW)
Figure 55. 40-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
6 mm × 6 mm Body, Very Thin Quad
(CP-40-13)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
AD9557BCPZ −40°C to +85°C 40-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-40-13
AD9557BCPZ-REEL7 −40°C to +85°C 40-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-40-13
AD9557/PCBZ −40°C to +85°C Evaluation Board CP-40-13
1
Z = RoHS Compliant Part.
I
2
C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
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D09197-0-5/13(B)