Datasheet

Data Sheet AD9525
Rev. A | Page 47 of 48
OUTLINE DIMENSIONS
112408-B
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-WKKD.
1
0.50
BSC
BOTTOM VIEW
TOP VIEW
PIN 1
INDICATOR
7.00
BSC SQ
48
13
24
25
36
37
12
EXPOSED
PAD
PIN 1
INDICATOR
5.20
5.10 SQ
5.00
0.45
0.40
0.35
SEATING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.25 MIN
0.20 REF
COPLANARITY
0.08
0.30
0.23
0.18
Figure 40. 48-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
7 mm × 7 mm Body, Very Very Thin Quad
CP-48-4
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
AD9525BCPZ −40°C to +85°C 48-Lead Lead Frame Chip Scale Package (LFCSP_WQ) CP-48-4
AD9525BCPZ-REEL7
−40°C to +85°C
48-Lead Lead Frame Chip Scale Package (LFCSP_WQ)
CP-48-4
AD9525/PCBZ Evaluation Board, No VCO
AD9525/PCBZ-VCO Evaluation Board, 2950 MHz VCO Installed
1
Z = RoHS Compliant Part.