Datasheet

AD9525 Data Sheet
Rev. A | Page 12 of 48
ABSOLUTE MAXIMUM RATINGS
Table 20.
Parameter Rating
VDD3 to GND −0.3 V to +3.6 V
VDD_CP, CP to GND −0.3 V to +5.8 V
REFA, REFA, REFB, REFB, REFC to GND
−0.3 V to VDD3 + 0.3 V
OUT_RSET to GND −0.3 V to VDD3 + 0.3 V
CP_RSET to GND −0.3 V to VDD3 + 0.3 V
CLKIN, CLKIN to GND
−0.3 V to VDD3 + 0.3 V
CLKIN to CLKIN
−1.2 V to +1.2 V
SCLK, SDIO, SDO, CS to GND
−0.3 V to VDD3 + 0.3 V
OUT0, OUT0, OUT1, OUT1, OUT2, OUT2,
OUT3,
OUT3, OUT4, OUT4, OUT5, OUT5,
OUT6, OUT6, OUT7, OUT7,
SYNC_OUT, SYNC_OUT to GND
−0.3 V to VDD3 + 0.3 V
RESET, PD, STATUS, REF_MON to GND
−0.3 V to VDD3 + 0.3 V
Junction Temperature
1
150°C
Storage Temperature Range −65°C to +150°C
Lead Temperature (10 sec) 300°C
1
See Table 21 for θ
JA
.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Table 21. Thermal Resistance (Simulated)
Package
Type
Airflow
Velocity
(m/sec) θ
JA
1, 2
θ
JC
1, 3
θ
JB
1, 4
Ψ
JT
1, 2
Unit
48-Lead
LFCSP
0 27.3 2.1 14.7 0.2 °C/W
1.0 23.9 0.3 °C/W
2.5 21.4 0.4 °C/W
1
Per JEDEC 51-7, plus JEDEC 51-5 2S2P test board.
2
Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
3
Per MIL-Std 883, Method 1012.1.
4
Per JEDEC JESD51-8 (still air).
ESD CAUTION