Datasheet

AD9522-1
Rev. 0 | Page 82 of 84
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4
091707-C
6.35
6.20 SQ
6.05
0.25 MIN
TOP VIEW
8.75
BSC SQ
9.00
BSC SQ
1
64
16
17
49
48
32
33
0.50
0.40
0.30
0.50
BSC
0.20 REF
12° MAX
0.80 MAX
0.65 TYP
1.00
0.85
0.80
7.50
REF
0.05 MAX
0.02 NOM
0.60 MAX
0.60
MAX
EXPOSED PAD
(BOTTOM VIEW)
SEATING
PLANE
PIN 1
INDICATOR
PIN 1
INDICATOR
0.30
0.23
0.18
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 74. 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
9 mm × 9 mm Body, Very Thin Quad
CP-64-4
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option
AD9522-1BCPZ
1
−40°C to +85°C 64-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-64-4
AD9522-1BCPZ-REEL7
1
−40°C to +85°C 64-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-64-4
AD9522-1/PCBZ
1
Evaluation Board
1
Z = RoHS Compliant Part.