Datasheet

AD9522-1
Rev. 0 | Page 16 of 84
ABSOLUTE MAXIMUM RATINGS
Table 19.
Parameter or Pin
With
Respect to Rating
VS GND −0.3 V to +3.6 V
VCP, CP GND −0.3 V to +5.8 V
REFIN, REFIN
GND −0.3 V to VS + 0.3 V
RSET, LF, BYPASS GND −0.3 V to VS + 0.3 V
CPRSET GND −0.3 V to VS + 0.3 V
CLK, CLK
GND −0.3 V to VS + 0.3 V
CLK
CLK
−1.2 V to +1.2 V
SCLK/SCL, SDIO/SDA, SDO, CS
GND −0.3 V to VS + 0.3 V
OUT0, OUT0, OUT1, OUT1,
OUT2, OUT2
, OUT3, OUT3,
OUT4, OUT4
, OUT5, OUT5,
OUT6, OUT6, OUT7, OUT7,
OUT8, OUT8, OUT9, OUT9,
OUT10, OUT10, OUT11, OUT11
GND −0.3 V to VS + 0.3 V
SYNC, RESET, PD
GND −0.3 V to VS + 0.3 V
REFMON, STATUS, LD GND −0.3 V to VS + 0.3 V
SP0, SP1, EEPROM GND −0.3 V to VS + 0.3 V
Junction Temperature
1
150°C
Storage Temperature Range −65°C to +150°C
Lead Temperature (10 sec) 300°C
1
See Table 20 for θ
JA
.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Thermal impedance measurements were taken on a JEDEC
JESD51-5 2S2P test board in still air in accordance with JEDEC
JESD51-2. See the Thermal Performance section for more details.
Table 20.
Package Type θ
JA
Unit
64-Lead LFCSP (CP-64-4) 22 °C/W
ESD CAUTION