Datasheet

Data Sheet AD9520-0
Rev. A | Page 17 of 80
ABSOLUTE MAXIMUM RATINGS
Table 19.
Parameter Rating
VS to GND −0.3 V to +3.6 V
VCP, CP to GND
−0.3 V to +5.8 V
VS_DRV to GND −0.3 V to +3.6 V
REFIN,
REFIN
to GND −0.3 V to V
S
+ 0.3 V
RSET, LF, BYPASS to GND −0.3 V to V
S
+ 0.3 V
CPRSET to GND −0.3 V to V
S
+ 0.3 V
CLK,
CLK
to GND −0.3 V to V
S
+ 0.3 V
CLK to
CLK
−1.2 V to +1.2 V
SCLK/SCL, SDIO/SDA, SDO,
CS
to GND −0.3 V to V
S
+ 0.3 V
OUT0,
OUT0
, OUT1,
OUT1
, OUT2,
OUT2
,
OUT3,
OUT3
, OUT4,
OUT4
, OUT5,
OUT5
,
OUT6,
OUT6
, OUT7,
OUT7
, OUT8,
OUT8
,
OUT9,
OUT9
, OUT10,
OUT10
, OUT11,
OUT11
to GND
−0.3 V to V
S
+ 0.3 V
SYNC
,
RESET
,
PD
to GND −0.3 V to V
S
+ 0.3 V
REFMON, STATUS, LD to GND −0.3 V to V
S
+ 0.3 V
SP0, SP1, EEPROM to GND −0.3 V to V
S
+ 0.3 V
Junction Temperature
1
125°C
Storage Temperature Range
−65°C to +150°C
Lead Temperature (10 sec) 300°C
1
See Table 20 for θ
JA
.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Thermal impedance measurements were taken on a JEDEC
JESD51-5 2S2P test board in still air, in accordance with JEDEC
JESD51-2. See the Thermal Performance section for more details.
Table 20.
Package Type θ
JA
Unit
64-Lead LFCSP (CP-64-4) 22 °C/W
ESD CAUTION