Datasheet

Data Sheet AD9517-1
Rev. E | Page 17 of 80
ABSOLUTE MAXIMUM RATINGS
Table 18.
Parameter Rating
VS, VS_LVPECL to GND −0.3 V to +3.6 V
VCP to GND −0.3 V to +5.8 V
REFIN, REFIN to GND
−0.3 V to V
S
+ 0.3 V
REFIN to REFIN
−3.3 V to +3.3 V
RSET to GND −0.3 V to V
S
+ 0.3 V
CPRSET to GND −0.3 V to V
S
+ 0.3 V
CLK, CLK to GND
−0.3 V to V
S
+ 0.3 V
CLK to CLK
−1.2 V to +1.2 V
SCLK, SDIO, SDO, CS to GND
−0.3 V to V
S
+ 0.3 V
OUT0, OUT0, OUT1, OUT1, OUT2, OUT2,
OUT3,
OUT3,OUT4, OUT4, OUT5, OUT5,
OUT6,
OUT6, OUT7, OUT7 to GND
−0.3 V to V
S
+ 0.3 V
SYNC to GND
−0.3 V to V
S
+ 0.3 V
REFMON, STATUS, LD to GND −0.3 V to V
S
+ 0.3 V
Junction Temperature
1
150°C
Storage Temperature Range −65°C to +150°C
Lead Temperature (10 sec) 300°C
1
See Table 19 for θ
JA
.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Table 19.
Package Type
1
θ
JA
Unit
48-Lead LFCSP 24.7 °C/W
1
Thermal impedance measurements were taken on a 4-layer board in still air
in accordance with EIA/JESD51-2.
ESD CAUTION