Datasheet

AD9513
Rev. 0 | Page 11 of 28
ABSOLUTE MAXIMUM RATINGS
Table 8.
Parameter or Pin
With
Respect
to
Min Max Unit
VS GND −0.3 +3.6 V
RSET GND −0.3 V
S
+ 0.3 V
CLK GND −0.3 V
S
+ 0.3 V
CLK CLKB −1.2 +1.2 V
OUT0, OUT1, OUT2 GND −0.3 V
S
+ 0.3 V
FUNCTION GND −0.3 V
S
+ 0.3 V
STATUS GND −0.3 V
S
+ 0.3 V
Junction Temperature
1
150 °C
Storage Temperature −65 +150 °C
Lead Temperature (10 sec) 300 °C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to
absolute maximum ratings for extended periods may affect
device reliability.
THERMAL CHARACTERISTICS
2
Thermal Resistance
32-Lead LFCSP
3
θ
JA
= 36.6°C/W
1
See Thermal Characteristics for θ
JA
.
2
Thermal impedance measurements were taken on a 4-layer board in still air
in accordance with EIA/JESD51-7.
3
The external pad of this package must be soldered to adequate copper land
on board.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.