Datasheet

AD9511
Rev. A | Page 18 of 60
ABSOLUTE MAXIMUM RATINGS
Table 12.
Parameter or Pin
With
Respect
to
Min Max Unit
VS GND −0.3 +3.6 V
VCP GND −0.3 +5.8 V
VCP V
S
−0.3 +5.8 V
REFIN, REFINB GND −0.3 V
S
+ 0.3 V
RSET GND −0.3 V
S
+ 0.3 V
CPRSET GND −0.3 V
S
+ 0.3 V
CLK1, CLK1B, CLK2, CLK2B GND −0.3 V
S
+ 0.3 V
CLK1 CLK1B −1.2 +1.2 V
CLK2 CLK2B −1.2 +1.2 V
SCLK, SDIO, SDO, CSB GND −0.3 V
S
+ 0.3 V
OUT0, OUT1, OUT2, OUT3,
OUT4
GND −0.3 V
S
+ 0.3 V
FUNCTION GND −0.3 V
S
+ 0.3 V
STATUS GND −0.3 V
S
+ 0.3 V
Junction Temperature 150 °C
Storage Temperature −65 +150 °C
Lead Temperature (10 sec) 300 °C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to
absolute maximum ratings for extended periods may affect
device reliability.
THERMAL CHARACTERISTICS
Thermal Resistance
1
48-Lead LFCSP
θ
JA
= 28.5°C/W
1
Thermal impedance measurements were taken on a 4-layer board in still air,
in accordance with EIA/JESD51-7.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.