Datasheet

Data Sheet AD9510
Rev. B | Page 17 of 56
ABSOLUTE MAXIMUM RATINGS
Table 12.
Parameter Value
VS to GND −0.3 V to +3.6 V
VCP to GND −0.3 V to +5.8 V
VCP to V
S
−0.3 V to +5.8 V
REFIN, REFINB to GND −0.3 V to V
S
+ 0.3 V
RSET to GND −0.3 V to V
S
+ 0.3 V
CPRSET to GND −0.3 V to V
S
+ 0.3 V
CLK1, CLK1B, CLK2, CLK2B to GND −0.3 V to V
S
+ 0.3 V
CLK1 to CLK1B
−1.2 V to +1.2 V
CLK2 to CLK2B −1.2 V to +1.2 V
SCLK, SDIO, SDO, CSB to GND −0.3 V to V
S
+ 0.3 V
OUT0, OUT1, OUT2, OUT3 to GND −0.3 V to V
S
+ 0.3 V
OUT4, OUT5, OUT6, OUT7 to GND −0.3 V to V
S
+ 0.3 V
FUNCTION to GND −0.3 V to V
S
+ 0.3 V
STATUS to GND −0.3 V to V
S
+ 0.3 V
Junction Temperature
1
150°C
Storage Temperature −65°C to +150°C
Lead Temperature (10 sec) 300°C
1
See Thermal Characteristics for θ
JA
.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL CHARACTERISTICS
Thermal impedance measurements were taken on a 4-layer
board in still air in accordance with EIA/JESD51-7.
Table 13. Thermal Resistance
Package θ
JA
Unit
64-Lead LFCSP 24 °C/W
ESD CAUTION