Datasheet

AD9484
Rev. A | Page 7 of 24
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter Rating
Electrical
AVDD to AGND −0.3 V to +2.0 V
DRVDD to DRGND −0.3 V to +2.0 V
AGND to DRGND −0.3 V to +0.3 V
AVDD to DRVDD −2.0 V to +2.0 V
D0+/D0− through D7+/D7−
to DRGND
−0.3 V to DRVDD + 0.2 V
DCO+, DCO− to DRGND −0.3 V to DRVDD + 0.2 V
OR+, OR− to DRGND −0.3 V to DRVDD + 0.2 V
CLK+ to AGND −0.3 V to AVDD + 0.2 V
CLK− to AGND −0.3 V to AVDD + 0.2 V
VIN+ to AGND −0.3 V to AVDD + 0.2 V
VIN− to AGND −0.3 V to AVDD + 0.2 V
SDIO/DCS to DRGND −0.3 V to DRVDD + 0.2 V
PDWN to AGND −0.3 V to DRVDD + 0.2 V
CSB to AGND −0.3 V to DRVDD + 0.2 V
SCLK/DFS to AGND −0.3 V to DRVDD + 0.2 V
CML to AGND −0.3 V to AVDD + 0.2 V
VREF to AGND −0.3 V to AVDD + 0.2 V
Environmental
Storage Temperature Range −65°C to +125°C
Operating Temperature Range −40°C to +85°C
Lead Temperature
(Soldering, 10 sec)
300°C
Junction Temperature 150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The exposed paddle must be soldered to the ground plane for
the LFCSP package. Soldering the exposed paddle to the PCB
increases the reliability of the solder joints, maximizing the
thermal capability of the package.
Table 6.
Package Type θ
JA
θ
JC
Unit
56-Lead LFCSP_VQ (CP-56-5) 23.7 1.7 °C/W
Typical θ
JA
and θ
JC
are specified for a 4-layer board in still air.
Airflow increases heat dissipation, effectively reducing θ
JA
. In
addition, metal in direct contact with the package leads from
metal traces, through holes, ground, and power planes reduces
the θ
JA
.
ESD CAUTION