Datasheet

AD9444
Rev. 0 | Page 39 of 40
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MS-026AED-HD
NOTES
1. CENTER FIGURES ARE TYPICAL UNLESS OTHERWISE NOTED.
2
. THE PACKAGE HAS A CONDUCTIVE HEAT SLUG TO HELP DISSIPATE HEAT AND ENSURE RELIABLE OPERATION O
F
THE DEVICE OVER THE FULL INDUSTRIAL TEMPERATURE RANGE. THE SLUG IS EXPOSED ON THE BOTTOM OF
THE PACKAGE AND ELECTRICALLY CONNECTED TO CHIP GROUND. IT IS RECOMMENDED THAT NO PCB SIGNA
L
TRACES OR VIAS BE LOCATED UNDER THE PACKAGE THAT COULD COME IN CONTACT WITH THE CONDUCTIV
E
SLUG. ATTACHING THE SLUG TO A GROUND PLANE WILL REDUCE THE JUNCTION TEMPERATURE OF THE
DEVICE WHICH MAY BE BENEFICIAL IN HIGH TEMPERATURE ENVIRONMENTS.
3. THE EXPOSED HEAT SINK SOLDERED TO THE GROUND PLANE IS REQUIRED FOR THE 100-LEAD TQFP/EP.
1
25
26 50
76100
75
51
14.00 SQ
16.00 SQ
0.27
0.22
0.17
0.50 BSC
1.05
1.00
0.95
0.15
0.05
0.75
0.60
0.45
SEATING
PLANE
1.20
MAX
1
25
2650
76 100
75
51
6.50
NOM
7°
3.5°
0°
COPLANARITY
0.08
0.20
0.09
TOP VIEW
(PINS DOWN)
BOTTOM VIEW
(PINS UP)
CONDUCTIVE
HEAT SINK
Figure 70. 100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
(SV-100-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Outline
AD9444BSVZ-80
1
–40°C to +85°C 100-Lead TQFP_EP SV-100-1
AD9444-CMOS/PCB CMOS Mode Evaluation Board
AD9444-LVDS/PCB LVDS Mode Evaluation Board
1
Z = Pb-free part.