Datasheet

AD9394 Data Sheet
Rev. B | Page 8 of 8
OUTLINE DIMENSIONS
A
B
C
D
0
.660
0
.595
0
.540
1.50
1.46
1.42
2.00
1.96
1.92
12
3
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
END VIEW
0.360
0.320
0.280
1.50
REF
1.00
REF
0.50
REF
0.390
0.360
0.330
BALL A1
IDENTIFIER
06-25-2010-B
SEATING
PLANE
0.270
0.240
0.210
COPLANARITY
0.05
Figure 5. 12-Ball Wafer Level Chip Scale Package [WLCSP]
1.5 mm × 2.0 mm Body
(CB-12-2)
Dimensions shown in millimeters
08591-004
0.5mm
1.5mm
1.0mm
SOLDER MASK
OPENING
NON-SOLDER MASK DEFINED PER IPC-7351 GUIDELINES
DETAIL A
DETAIL A
0.35mm
0.25mm
LAND
Figure 6. Recommended Solder Land Pattern
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option Branding
AD9394BCBZ-R7 −40°C to +85°C 12-Ball WLCSP CB-12-2 L8V
EVAL-AD9394Z Evaluation Board
1
Z = RoHS Compliant Part.
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D08591-0-10/11(B)