Datasheet

AD9393
Rev. 0 | Page 37 of 40
OUTLINE DIMENSIONS
*
COMPLIANT TO JEDEC STANDARDS MO-225
WITH THE EXCEPTION TO PACKAGE HEIGHT.
A
B
C
D
E
F
G
J
H
K
10 8 7 6
3
2
1
9
5
4
A
1 CORNER
INDEX AREA
TOP VIEW
BALL A1
PAD CORNER
DETAIL A
BOTTOM VIEW
0.75
REF
6.10
6.00 SQ
5.90
SEATING
PLANE
BALL DIAMETER
0.15 MIN
0.35
0.30
0.25
COPLANARITY
0.08 MAX
0.65 MIN
0.50
BSC
4.50
BSC SQ
*
1.40 MAX
010807-A
DETAIL A
Figure 9. 76-Pin Chip Scale Package Pin Grid Array [CSP_BGA]
6 mm × 6 mm × 1.2 mm
(BC-76-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Max Speed
(MHz) Digital
Temperature
Range
Package Description Package Option
AD9393BBCZ-80
1
80 −10°C to +80°C 76-Pin Chip Scale Package Pin Grid Array (CSP_BGA) BC-76-2
AD9393BBCZRL-80
1
80 −10°C to +80°C 76-Pin Chip Scale Package Pin Grid Array (CSP_BGA) BC-76-2
AD9393/PCBZ
1
Evaluation Board
1
Z = RoHS Compliant Part.