Datasheet

Data Sheet AD9284
Rev. A | Page 7 of 24
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter Rating
Electrical
AVDD to AGND −0.3 V to +2.0 V
DRVDD to DRGND −0.3 V to +2.0 V
AGND to DRGND −0.3 V to +0.3 V
AVDD to DRVDD −2.0 V to +2.0 V
D0+/D0− through D7+/D7−
to DRGND
−0.3 V to DRVDD + 0.3 V
DCO+, DCO− to DRGND −0.3 V to DRVDD + 0.3 V
CLK+, CLK− to AGND −0.3 V to AVDD + 0.2 V
VIN±A, VIN±B to AGND
−0.3 V to AVDD + 0.2 V
SDIO/PWDN to DRGND −0.3 V to DRVDD + 0.3 V
CSB to AGND −0.3 V to DRVDD + 0.3 V
SCLK to AGND −0.3 V to DRVDD + 0.3 V
Environmental
Storage Temperature Range −65°C to +125°C
Operating Temperature Range −40°C to +85°C
Lead Temperature
(Soldering, 10 sec)
300°C
Junction Temperature 150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 7. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
48-Lead LFCSP (CP-48-12) 30.4 2.9 °C/W
ESD CAUTION