Datasheet

AD9279
Rev. 0 | Page 9 of 44
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter Rating
AVDD1 to GND −0.3 V to +2.0 V
AVDD2 to GND −0.3 V to +3.9 V
DRVDD to GND −0.3 V to +2.0 V
GND to GND −0.3 V to +0.3 V
AVDD2 to AVDD1 −2.0 V to +3.9 V
AVDD1 to DRVDD −2.0 V to +2.0 V
AVDD2 to DRVDD −2.0 V to +3.9 V
Digital Outputs (DOUTx+, DOUTx−,
DCO+, DCO−, FCO+, FCO−) to GND
−0.3 V to
DRVDD + 0.3 V
CLK+, CLK−, SDIO to GND −0.3 V to
AVDD1 + 0.3 V
LI-x, LO-x, LOSW-x to GND −0.3 V to
AVDD2 + 0.3 V
CWI−, CWI+, CWQ−, CWQ+ to GND −0.3 V to
AVDD2 + 0.3 V
PDWN, STBY, SCLK, CSB to GND −0.3 V to
AVDD1 + 0.3 V
GAIN+, GAIN−, RESET, 4LO+, 4LO−,
GPO0, GPO1, GPO2, GPO3 to GND
−0.3 V to
AVDD2 + 0.3 V
VREF to GND −0.3 V to
AVDD1 + 0.3 V
Operating Temperature Range (Ambient) −40°C to +85°C
Storage Temperature Range (Ambient) −65°C to +150°C
Maximum Junction Temperature 150°C
Lead Temperature (Soldering, 10 sec) 300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL IMPEDANCE
Table 5.
Symbol Description Value
1
Units
θ
JA
Junction-to-ambient thermal
resistance, 0.0 m/s air flow per
JEDEC JESD51-2 (still air)
22.0 °C/W
Ψ
JB
Junction-to-board thermal
characterization parameter, 0 m/s
air flow per JEDEC JESD51-8 (still air)
9.2 °C/W
Ψ
JT
Junction-to-top-of-package
characterization parameter, 0 m/s
air flow per JEDEC JESD51-2 (still air)
0.12 °C/W
1
Results are from simulations. PCB is JEDEC multilayer. Thermal performance
for actual applications requires careful inspection of the conditions in the
application to determine if they are similar to those assumed in these
calculations.
ESD CAUTION