Datasheet

AD9279
Rev. 0 | Page 43 of 44
OUTLINE DIMENSIONS
*
COMPLIANT WITH JEDEC STANDARDS MO-275-EEAB-1
WITH EXCEPTION TO PACKAGE HEIGHT.
10-21-2010-B
0.80
0.60
REF
A
B
C
D
E
F
G
910 81112 7 564231
BOTTOM VIEW
8.80
BSC SQ
H
J
K
L
M
DETAIL A
TOP VIEW
DETAIL A
COPLANARITY
0.20
0.50
0.45
0.40
*
1.40 MAX
BALL DIAMETER
SEATING
PLANE
10.10
10.00 SQ
9.90
A1 BALL
CORNER
A1 BALL
CORNER
0.25 MIN
0.65 MIN
Figure 70. 144-Ball Chip Scale Package, Ball Grid Array [CSP_BGA]
(BC-144-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
AD9279-BBCZ −40°C to +85°C 144-Ball Chip Scale Package, Ball Grid Array [CSP_BGA] BC-144-1
AD9279-65EBZ Evaluation Board
AD9279-80KITZ Evaluation Board and High Speed FPGA-Based Data Capture Board
1
Z = RoHS Compliant Part.