Datasheet

AD9272
Rev. C | Page 11 of 44
ABSOLUTE MAXIMUM RATINGS
Table 4.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Parameter
With
Respect To Rating
Electrical
AVDD1 GND −0.3 V to +2.0 V
AVDD2 GND −0.3 V to +3.9 V
DRVDD GND −0.3 V to +2.0 V
GND GND −0.3 V to +0.3 V
AVDD2 AVDD1 −2.0 V to +3.9 V
AVDD1 DRVDD −2.0 V to +2.0 V
AVDD2 DRVDD −2.0 V to +3.9 V
Digital Outputs
(DOUTx+, DOUTx−,
DCO+, DCO−,
FCO+, FCO−)
GND −0.3 V to +2.0 V
CLK+, CLK−,
GAIN+,GAIN−
GND −0.3 V to +3.9 V
LI-x, LO-x, LOSW-x LG-x −0.3 V to +2.0 V
CWDx−, CWDx+ GND −0.3 V to +3.9 V
GND −0.3 V to +2.0 V
PDWN, STBY, SCLK, CSB GND −0.3 V to +3.9 V
RBIAS, VREF, SDIO GND −0.3 V to +2.0 V
Environmental
Operating Temperature
Range (Ambient)
−40°C to +85°C
Storage Temperature
Range (Ambient)
−65°C to +150°C
Maximum Junction
Temperature
150°C
Lead Temperature
(Soldering, 10 sec)
300°C
THERMAL IMPEDANCE
Table 5.
Air Flow Velocity (m/sec) θ
JA
1
θ
JB
θ
JC
Unit
0.0 20.3 N/A N/A °C/W
1.0 14.4 7.6 4.7 °C/W
2.5 12.9 N/A N/A °C/W
1
θ
JA
is for a 4-layer PCB with a solid ground plane (simulated). The exposed
pad is soldered to the PCB.
ESD CAUTION