Datasheet

AD9271
Rev. B | Page 10 of 60
ABSOLUTE MAXIMUM RATINGS
Table 4.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Parameter
With
Respect To Rating
ELECTRICAL
AVDD GND −0.3 V to +2.0 V
DRVDD GND −0.3 V to +2.0 V
CWVDD GND −0.3 V to +3.9 V
GND GND −0.3 V to +0.3 V
AVDD DRVDD −2.0 V to +2.0 V
Digital Outputs
(DOUTx+, DOUTx−,
DCO+, DCO−,
FCO+, FCO−)
GND −0.3 V to +2.0 V
CLK+, CLK− GND −0.3 V to +3.9 V
LI-x LG-x −0.3 V to +2.0 V
LO-x LG-x −0.3 V to +2.0 V
LOSW-x LG-x −0.3 V to +2.0 V
CWDx−, CWDx+ GND −0.3 V to +3.9 V
SDIO, GAIN+, GAIN− GND −0.3 V to +2.0 V
PDWN, STBY, SCLK, CSB GND −0.3 V to +3.9 V
REFT, REFB, RBIAS GND −0.3 V to +2.0 V
VREF, SENSE GND −0.3 V to +2.0 V
ENVIRONMENTAL
Operating Temperature
Range (Ambient)
−40°C to +85°C
Storage Temperature
Range (Ambient)
−65°C to +150°C
Maximum Junction
Temperature
150°C
Lead Temperature
(Soldering, 10 sec)
300°C
THERMAL IMPEDANCE
Table 5.
Air Flow Velocity (m/s) θ
JA
1
θ
JB
θ
JC
Unit
0.0 20.3 °C/W
1.0 14.4 7.6 4.7 °C/W
2.5 12.9 °C/W
1
θ
JA
for a 4-layer PCB with solid ground plane (simulated). Exposed pad
soldered to PCB.
ESD CAUTION