Datasheet

AD9255 Data Sheet
Rev. C | Page 10 of 44
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter Rating
Electrical
AVDD to AGND −0.3 V to +2.0 V
DRVDD to AGND −0.3 V to +2.0V
SVDD to AGND −0.3 V to +3.6 V
VIN+, VIN− to AGND
−0.3 V to AVDD + 0.2 V
CLK+, CLK− to AGND −0.3 V to AVDD + 0.2 V
SYNC to AGND −0.3 V to AVDD + 0.2 V
VREF to AGND −0.3 V to AVDD + 0.2 V
SENSE to AGND −0.3 V to AVDD + 0.2 V
VCM to AGND −0.3 V to AVDD + 0.2 V
RBIAS to AGND
−0.3 V to AVDD + 0.2 V
CSB to AGND −0.3 V to SVDD +0.3 V
SCLK/DFS to AGND −0.3 V to SVDD +0.3 V
SDIO/DCS to AGND −0.3V to SVDD + 0.3 V
OEB to AGND −0.3 V to DRVDD + 0.2 V
PDWN to AGND −0.3 V to DRVDD + 0.2 V
LVDS to AGND −0.3 V to AVDD + 0.2 V
LVDS_RS to AGND −0.3 V to AVDD + 0.2 V
DITHER to AGND −0.3 V to AVDD + 0.2 V
D0 through D13 to AGND −0.3 V to DRVDD + 0.2 V
DCO to AGND −0.3 V to DRVDD + 0.2 V
Environmental
Operating Temperature Range
(Ambient)
−40°C to +85°C
Maximum Junction Temperature
Under Bias
150°C
Storage Temperature Range
(Ambient)
−65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL CHARACTERISTICS
The exposed paddle must be soldered to the ground plane for
the LFCSP package. Soldering the exposed paddle to the customer
board increases the reliability of the solder joints and maximizes
the thermal capability of the package.
Typical θ
JA
is specified for a 4-layer PCB with a solid ground
plane. As shown, airflow improves heat dissipation, which
reduces θ
JA
. In addition, metal in direct contact with the package
leads from metal traces, through holes, ground, and power
planes, reduces the θ
JA
.
Table 7. Thermal Resistance
Package Type
Airflow
Velocity
(m/s) θ
JA
1, 2
θ
JC
1, 3
θ
JB
1, 4
Unit
48-Lead LFCSP
(CP-48-8)
0 24.5 1.3 12.7 °C/W
1.0 21.4 °C/W
2.5 19.2 °C/W
1
Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board.
2
Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
3
Per MIL-Std 883, Method 1012.1.
4
Per JEDEC JESD51-8 (still air).
ESD CAUTION