Datasheet

AD9248
Rev. B | Page 45 of 48
04446-058
Figure 58. PCB Bottom-Side Silkscreen
THERMAL CONSIDERATIONS
The AD9248 LFCSP has an integrated heat slug
that improves the thermal and electrical properties of the
package when locally attached to a ground plane at the PCB.
A thermal (filled) via array to a ground plane beneath the
part provides a path for heat to escape the package, lowering
junction temperature. Improved electrical performance
also results from the reduction in package parasitics due to
proximity of the ground plane. Recommended array is 0.3 mm
vias on 1.2 mm pitch. θ
JA
= 26.4°C/W with this recommended
configuration. Soldering the slug to the PCB is a requirement
for this package.
04446-059
Figure 59. Thermal Via Array