Datasheet

Data Sheet AD9245
Rev. E | Page 11 of 32
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
VREF
SENSE
MODE
OTR
D13 (MSB)
D12
D11
D1
(LSB) D0
PDWN
D3
D2
D9
D8
D7
D6
D5
D
4
DGND
DRVDD
AVDD
A
GND
VIN–
VIN+
AGND
AVDD
REFT
REFB
DNC
CLK
DNC
D10
NOTES
1. DNC = DO NOT CONNECT. DO NOT CONNECT TO THIS PIN.
2. IT IS RECOMMENDED THAT THE EXPOSED PADDLE BE SOLDERED TO THE GROUND PLANE
FOR THE LFCSP PACKAGE. THERE IS AN INCREASED RELIABILITY OF THE SOLDER JOINTS,
AND THE MAXIMUM THERMAL CAPABILITY OF THE PACKAGE IS ACHIEVED WITH THE
EXPOSED PADDLE SOLDERED TO THE CUSTOMER BOARD.
03583-022
24
23
22
21
20
19
18
17
1
2
3
4
5
6
7
8
9
10
11
12 13 14 15 16
32 31 30 29 28 27 26 25
AD9245
TOP VIEW
(Not to Scale)
Figure 3. LFCSP Pin Configuration
Table 9. Pin Function Descriptions
Pin No. Mnemonic Description
1, 3 DNC Do Not Connect
2 CLK Clock Input Pin
4 PDWN Power-Down Function Select
5 to 14, 17 to 20 D0 (LSB) to D13 (MSB) Data Output Bits
15 DGND Digital Output Ground
16 DRVDD Digital Output Driver Supply
21 OTR Out-of-Range Indicator
22 MODE Data Format Select and DCS Mode Selection (See Table 11)
23 SENSE Reference Mode Selection (See Table 10)
24 VREF Voltage Reference Input/Output
25 REFB Differential Reference (–)
26 REFT Differential Reference (+)
27, 32 AVDD Analog Power Supply
28, 31 AGND Analog Ground
29 VIN+ Analog Input Pin (+)
30 VIN– Analog Input Pin (–)
EPAD
Exposed Pad. It is recommended that the exposed paddle be soldered to the ground
plane for the LFCSP package. There is an increased reliability of the solder joints, and
the maximum thermal capability of the package is achieved with the exposed paddle
soldered to the customer board.