Datasheet

AD9238
Rev. C | Page 44 of 48
02640-077
Figure 58. PCB Bottom-Side Silkscreen
02640-078
THERMAL CONSIDERATIONS
The AD9238 LFCSP has an integrated heat slug that improves
the thermal and electrical properties of the package when locally
attached to a ground plane at the PCB. A thermal (filled) via array
to a ground plane beneath the part provides a path for heat to
escape the package, lowering junction temperature. Improved
electrical performance also results from the reduction in package
parasitics due to proximity of the ground plane. Recommended
array is 0.3 mm vias on 1.2 mm pitch. θ
JA
= 26.4°C/W with this
recommended configuration. Soldering the slug to the PCB is a
requirement for this package.
Figure 59. Thermal Via Array