Datasheet

AD9237 Data Sheet
Rev. B | Page 8 of 24
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
05455-003
NOTES
1. DNC = DO NOT CONNECT.
2. IT IS RECOMMENDED THAT THE EXPOSED PADDLE
BE SOLDERED TO THE GROUND PLANE.
MODE2
CLK
OE
PDWN
GC
DNC
D0 (LSB)
D1
VREF
SENSE
MODE
OTR
D11 (MSB)
D10
D9
D8
D2
D3
D4
D5
D6
D
7
DGND
DRVDD
AVDD
AGND
VIN–
VIN+
AGND
AVDD
REFT
REFB
1
2
3
4
5
6
7
8
24
23
22
21
20
19
18
17
9
10 11 12 13 14 15 16
32 31 30 29 28 27 26 25
AD9237
TOP VIEW
(Not to Scale)
Figure 3. Pin Configuration
Table 6. Pin Function Descriptions
Pin Number Mnemonic Description
1 MODE2 SHA Gain Select and Power Scaling Control (see Table 8).
2 CLK Clock Input Pin.
3 OE Output Enable Pin (Active Low).
4 PDWN Power-Down Function Selection (see Table 9).
5 GC Gray Code Control (Active High).
6 DNC Do Not Connect.
7 to 14, 17 to 20 D0 (LSB) to D11 (MSB) Data Output Bits.
15 DGND Digital Output Ground.
16 DRVDD
Digital Output Driver Supply. Must be decoupled to DGND with a minimum 0.1 μF capacitor.
Recommended decoupling is 0.1 μF in parallel with 10 μF.
21 OTR Out-of-Range Indicator.
22 MODE Data Format and Clock Duty Cycle Stabilizer (DCS) Mode Selection (see Table 10).
23 SENSE Reference Mode Selection (see Table 7).
24 VREF Voltage Reference Input/Output (see Table 7).
25 REFB Differential Reference (−). Must be decoupled to REFT with a minimum 10 μF capacitor.
26 REFT Differential Reference (+).
27, 32 AVDD
Analog Power Supply. Must be decoupled to AGND with a minimum 0.1 μF capacitor.
Recommended decoupling is 0.1 μF in parallel with 10 μF.
28, 31 AGND Analog Ground.
29 VIN+ Analog Input Pin (+).
30 VIN− Analog Input Pin (−).
EP
It is recommended that the exposed paddle be soldered to the ground plane. There is an
increased reliability of the solder joints and maximum thermal capability of the package is
achieved with exposed paddle soldered to the customer board.