Datasheet

Data Sheet AD9236
Rev. C | Page 9 of 36
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
03066-0-021
AD9236
TOP VIEW
(Not to Scale)
OTR
1 D11 (MSB)28
MODE
2
D10
27
SENSE
3
D9
26
VREF 4
D8
25
REFB 5
DRVDD
24
REFT 6
DGND
23
AVDD 7
D7
22
AGND
8 D6
21
VIN+ 9
D5
20
VIN– 10 D4
19
AGND
11 D318
AVDD 12
D217
CLK
13 D1
16
PDWN 14
D0 (LSB)15
Figure 3. 28-Lead TSSOP
03066-0-022
NOTES
1. DNC = DO NOT CONNECT.
2. IT IS RECOMMENDED THAT THE EXPOSED PADDLE BE
SOLDERED TO THE GROUND PLANE FOR THE LFCSP. THERE
IS AN INCREASED RELIABILITY OF THE SOLDER JOINTS, AND
THE MAXIMUM THERMAL CAPABILITY OF THE PACKAGE IS
ACHIEVED WITH THE EXPOSED PADDLE SOLDERED TO THE
CUSTOMER BOARD.
DNC
CLK
DNC
PDWN
DNC
DNC
(LSB) D0
D1
VREF
SENSE
MODE
OTR
D11 (MSB)
D10
D9
D8
D2
D3
D4
D5
D6
D7
DGND
DRVDD
AVDD
AGND
VIN–
VIN+
AGND
AVDD
REFT
REFB
1
2
3
4
5
6
7
8
24
23
22
21
20
19
18
17
9
10 11 12 13 14 15 16
32 31 30 29 28 27 26 25
AD9236
TOP VIEW
(Not to Scale)
Figure 4. 32-Lead LFCSP
Table 8. Pin Function Descriptions—28-Lead TSSOP
Pin No. Mnemonic Description
1 OTR Out-of-Range Indicator
2 MODE Data Format Select and DCS
Mode Selection
3 SENSE Reference Mode Selection
4 VREF Voltage Reference Input/Output
5 REFB Differential Reference (–)
6 REFT Differential Reference (+)
7, 12 AVDD Analog Power Supply
8, 11 AGND Analog Ground
9
VIN+
Analog Input Pin (+)
10 VIN– Analog Input Pin (–)
13 CLK Clock Input Pin
14 PDWN Power-Down Function Select
15 to 22,
25 to 28
D0 (LSB) to
D11 (MSB)
Data Output Bits
23 DGND Digital Output Ground
24 DRVDD Digital Output Driver Supply
Table 9. Pin Function Descriptions—32-Lead LFCSP
Pin No. Mnemonic Description
1, 3, 5, 6 DNC Do Not Connect
2 CLK Clock Input Pin
4 PDWN Power-Down Function Select
7 to 14,
17 to 20
D0 (LSB) to
D11 (MSB)
Data Output Bits
15 DGND Digital Output Ground
16 DRVDD Digital Output Driver Supply
21 OTR Out-of-Range Indicator
22 MODE Data Format Select and DCS Mode
Selection
23 SENSE Reference Mode Selection
24 VREF Voltage Reference Input/Output
25 REFB Differential Reference (–)
26 REFT Differential Reference (+)
27, 32 AVDD Analog Power Supply
28, 31 AGND Analog Ground
29 VIN+ Analog Input Pin (+)
30 VIN– Analog Input Pin (–)
EP Exposed Pad. It is recommended
that the exposed paddle be soldered
to the ground plane for the LFCSP.
There is an increased reliability of the
solder joints, and the maximum
thermal capability of the package is
achieved with the exposed paddle
soldered to the customer board.