Datasheet

Data Sheet AD9236
Rev. C | Page 7 of 36
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
With
Respect to
Min Max Unit
ELECTRICAL
AVDD AGND 0.3 +3.9 V
DRVDD DGND 0.3 +3.9 V
AGND DGND 0.3 +0.3 V
AVDD DRVDD 3.9 +3.9 V
D0 to D11 DGND 0.3 DRVDD + 0.3 V
CLK, MODE AGND 0.3 AVDD + 0.3 V
VIN+, VIN AGND 0.3 AVDD + 0.3 V
VREF AGND 0.3 AVDD + 0.3 V
SENSE
AGND
0.3
AVDD + 0.3
V
REFT, REFB AGND 0.3 AVDD + 0.3 V
PDWN AGND 0.3 AVDD + 0.3 V
ENVIRONMENTAL
Storage Temperature 65 +125 °C
Operating Temperature Range 40 +85 °C
Lead Temperature
(Soldering 10 sec)
300 °C
Junction Temperature
150
°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or
any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions on a 4-layer board
in still air, in accordance with EIA/JESD51-1.
Table 7.
Package Type
θ
JA
θ
JC
Unit
RU-28 67.7 °C/W
CP-32-7
32.5
32.71
°C/W
Airflow increases heat dissipation effectively, reducing θ
JA
. In
addition, more metal directly in contact with the package leads
from metal traces, through holes, ground, and power planes
reduces the θ
JA
. It is recommended that the exposed paddle be
soldered to the ground plane for the LFCSP package. There is
an increased reliability of the solder joints, and maximum
thermal capability of the package is achieved with the exposed
paddle soldered to the customer board.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.