Datasheet

Data Sheet AD9236
Rev. C | Page 33 of 36
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-153-AE
28
15
141
8°
0°
SEATING
PLANE
C
OPLANARIT
Y
0.10
1.20 MAX
6.40 BSC
0.65
BSC
PIN 1
0.30
0.19
0.20
0.09
4.50
4.40
4.30
0.75
0.60
0.45
9.80
9.70
9.60
0.15
0.05
Figure 57. 28-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-28)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-220-WHHD.
112408-A
1
0.50
BSC
BOTTOM VIEWTOP VIEW
PIN 1
INDI
C
ATOR
32
916
17
24
25
8
EXPOSED
PAD
P
I
N
1
I
N
D
I
C
A
T
O
R
3.25
3.10 SQ
2.95
S
EATING
PLANE
0.05 MAX
0.02 NOM
0.20 REF
COPLANARITY
0.08
0.30
0.25
0.18
5.10
5.00 SQ
4.90
0.80
0.75
0.70
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.50
0.40
0.30
0.25 MIN
Figure 58. 32-Lead Frame Chip Scale Package [LFCSP_WQ]
5 mm × 5 mm Body, Very Very Thin Quad
(CP-32-7)
Dimensions shown in millimeters