Datasheet

Data Sheet AD9235
Rev. D | Page 37 of 40
ORDERING GUIDE
Model
1, 2
Temperature Range
Package Description
Package Option
AD9235BRU-20 –40°C to +85°C 28-Lead Thin Shrink Small Outline Package (TSSOP) RU-28
AD9235BRURL7-20 –40°C to +85°C 28-Lead Thin Shrink Small Outline Package (TSSOP) RU-28
AD9235BRUZ-20 –40°C to +85°C 28-Lead Thin Shrink Small Outline Package (TSSOP) RU-28
AD9235BRUZRL7-20 –40°C to +85°C 28-Lead Thin Shrink Small Outline Package (TSSOP) RU-28
AD9235BRU-40 –40°C to +85°C 28-Lead Thin Shrink Small Outline Package (TSSOP) RU-28
AD9235BRURL7-40 –40°C to +85°C 28-Lead Thin Shrink Small Outline Package (TSSOP) RU-28
AD9235BRUZ-40 –40°C to +85°C 28-Lead Thin Shrink Small Outline Package (TSSOP) RU-28
AD9235BRUZRL7-40 –40°C to +85°C 28-Lead Thin Shrink Small Outline Package (TSSOP) RU-28
AD9235BRU-65 –40°C to +85°C 28-Lead Thin Shrink Small Outline Package (TSSOP) RU-28
AD9235BRURL7-65 –40°C to +85°C 28-Lead Thin Shrink Small Outline Package (TSSOP) RU-28
AD9235BRUZ-65 –40°C to +85°C 28-Lead Thin Shrink Small Outline Package (TSSOP) RU-28
AD9235BRUZRL7-65 –40°C to +85°C 28-Lead Thin Shrink Small Outline Package (TSSOP) RU-28
AD9235BCPZ-20
–40°C to +85°C
32-Lead Lead Frame Chip Scale Package (LFCSP_WQ)
CP-32-7
AD9235BCPZRL7-20 –40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_WQ) CP-32-7
AD9235BCPZ-40 –40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_WQ) CP-32-7
AD9235BCPZRL7-40 –40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_WQ) CP-32-7
AD9235BCPZ-65 –40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_WQ) CP-32-7
AD9235BCPZRL7-65 –40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_WQ) CP-32-7
1
Z = RoHS Compliant Part.
2
It is recommended that the exposed paddle be soldered to the ground plane. There is an increased reliability of the solder joints and maximum thermal capability of
the package is achieved with exposed paddle soldered to the customer board.