Datasheet

AD9228 Data Sheet
Rev. E | Page 10 of 56
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
With
Respect To
Rating
ELECTRICAL
AVDD AGND −0.3 V to +2.0 V
DRVDD DRGND −0.3 V to +2.0 V
AGND DRGND −0.3 V to +0.3 V
AVDD DRVDD −2.0 V to +2.0 V
Digital Outputs
(D + x, D − x, DCO+,
DCO−, FCO+, FCO−)
DRGND −0.3 V to +2.0 V
CLK+, CLK− AGND −0.3 V to +3.9 V
VIN + x, VIN − x AGND −0.3 V to +2.0 V
SDIO/ODM AGND −0.3 V to +2.0 V
PDWN, SCLK/DTP, CSB AGND −0.3 V to +3.9 V
REFT, REFB, RBIAS AGND −0.3 V to +2.0 V
VREF, SENSE AGND −0.3 V to +2.0 V
ENVIRONMENTAL
Operating Temperature
Range (Ambient)
−40°C to +85°C
Maximum Junction
Temperature
150°C
Lead Temperature
(Soldering, 10 sec)
300°C
Storage Temperature
Range (Ambient)
−65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL IMPEDANCE
Table 6.
Air Flow Velocity (m/sec) θ
JA
1
θ
JB
θ
JC
Unit
0.0 24 °C/W
1.0 21 12.6 1.2 °C/W
2.5 19 °C/W
1
θ
JA
for a 4-layer PCB with solid ground plane (simulated). Exposed pad
soldered to PCB.
ESD CAUTION