Datasheet

AD9216
Rev. A | Page 37 of 40
THERMAL CONSIDERATIONS
The AD9216 LFCSP package has an integrated heat slug that
improves the thermal and electrical properties of the package
when locally attached to a ground plane at the PCB. A thermal
(filled) via array to a ground plane beneath the part provides
a path for heat to escape the package, lowering junction
temperature. Improved electrical performance also results
from the reduction in package parasitics due to proximity
of the ground plane. Recommended array is 0.3 mm vias
on 1.2 mm pitch. θ
JA
= 26.4°C/W with this recommended
configuration. Soldering the slug to the PCB is a require-
ment for this package.
04775-047
Figure 60. Thermal Via Array