Datasheet

Data Sheet AD9148
Rev. B | Page 9 of 72
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
With
Respect To
Rating
AVDD33, IOVDD
AGND,
DGND,
CGND
−0.3 V to +3.6 V
DVDD18, CVDD18
AGND,
DGND,
CGND
−0.3 V to +2.10 V
AGND
DGND,
CGND
−0.3 V to +0.3 V
DGND
AGND,
CGND
−0.3 V to +0.3 V
CGND
AGND,
DGND
−0.3 V to +0.3 V
I120, VREF AGND −0.3 V to AVDD33 + 0.3 V
IOUT1_P, IOUT1_N,
IOUT2_P, IOUT2_N,
IOUT3_P, IOUT3_N,
IOUT4_P, IOUT4_N
AGND −1.0 V to AVDD33 + 0.3 V
A15_P to A0_P,
A15_N to A0_N,
B15_P to B0_P,
B15_N, B0_N
DGND −0.3 V to DVDD18 + 0.3 V
DCIA_P, DCIA_N,
FRAMEA_P, FRAMEA_N,
DCIB_P, DCIB_N,
FRAMEB_P, FRAMEB_N
DGND −0.3 V to DVDD18+ 0.3 V
CLK_P, CLK_N,
REFCLK_P, REFCLK_N
CGND −0.3 V to CVDD18 + 0.3 V
CSB, SCLK, SDIO, SDO,
TDO, TDI, TCK, TMS,
RESET, IRQ, PLL_LOCK
DGND −0.3 V to IOVDD + 0.3 V
Junction Temperature 125°C
Storage Temperature
Range
−65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Typical θ
JA
, θ
JB
, and θ
JC
are specified vs. the number of PCB layers in
still air for each package offering. Airflow increases heat dissipation
effectively reducing θ
JA
and θ
JB
.
Table 7. Thermal Resistance
Package Type
θ
JA
θ
JB
θ
JC
Unit
Notes
196-Ball CSP_BGA 24.7 12.6 5.7 °C/W
4-layer board,
25 PCB vias
19.2 10.9 5.3 °C/W
8-layer board,
25 PCB vias
18.1 10.5 5.3 °C/W
10-layer board,
25 PCB vias
18.0 10.5 5.3 °C/W
12-layer board,
25 PCB vias
196-Ball BGA_ED 20.9 8.6 3.1 °C/W
4-layer board,
25 PCB vias
16.2
7.7
3.1
°C/W
8-layer board,
25 PCB vias
15.2 7.4 3.1 °C/W
10-layer board,
25 PCB vias
15.0 7.4 3.1 °C/W
12-layer board,
25 PCB vias
MAXIMUM SAFE POWER DISSIPATION
The maximum junction temperature for the AD9148 is 125°C.
With the thermal resistance of the molded package (CSP_BGA)
given for a 12 layer board, the maximum power that can be
dissipated in this package can be calculated as
( )
( )
W
TT
Power
JA
A
J
MAX
22.2
0.18
85125
=
−
=
θ
−
=
To increase the maximum power, the AD9148 is available in a
second package option (BGA_ED), which includes a heat spreader
on top of the package. Also, an external heat sink can be attached to
the top of the AD9148 CSP_BGA package. The adjusted maximum
power for each of these conditions is shown in Tabl e 8.
With the thermal resistance of the heat spreader package (BGA_ED)
given for a 12-layer board, the maximum power that can be
dissipated in this package can be calculated as
( )
( )
W
TT
Power
JA
A
J
MAX
67.2
0.15
85125
=
−
=
θ
−
=
To increase the maximum power, an external heat sink can be
attached to the top of the AD9148 BGA_ED package. The adjusted
maximum power for an external heat sink is shown in Tabl e 8.
To aid in the selection of package, the maximum f
DAC
rate for a given
power dissipation over several operating conditions is shown in
Tabl e 9. The maximum f
DAC
rate applies to all interpolation rates.
Note that, if the programmable inverse sinc filter is enabled, the
maximum f
DAC
rate specified in Table 9 decreases.
ESD CAUTION