Datasheet

AD9148 Data Sheet
Rev. B | Page 10 of 72
Table 8. Thermal Resistance and Maximum Power
PCB
Maximum
Power (W)
Package Type T
A
(°C) PCB Layers PCB Vias External Heat Sink
1
Case T
J
(°C) θ
JA
(°C/W)
196-ball CSP_BGA 85 12 25 No CSP_BGA 125 18.0 2.22
196-ball CSP_BGA 85 12 25 Yes CSP_BGA 125 16.0 2.50
196-ball BGA_ED 85 12 25 No BGA_ED 125 15.0 2.67
196-ball BGA_ED 85 12 25 Yes BGA_ED 125 14.0 2.86
1
Heat sink is used in the thermal model: 13 mm × 13 mm, 15 mm tall.
Table 9. Power vs. f
DAC
Rate and Functionality
Maximum f
DAC
(MSPS)
1
Coarse Modulation Fine Modulation (NCO)
Maximum Power (W) Package Heat-Sink Combination
2
PLL Off PLL On PLL Off PLL On
2.22
CSP_BGA
No
820
740
695
630
2.50 CSP_BGA Yes 950 875 810 740
2.67 BGA_EP No 1000 945 870 810
2.86 BGA_EP Yes 1000 1000 940 870
1
Typical maximum f
DAC
rate with inverse sinc filter off.
2
Heat sink is used in the thermal model: 13 mm × 13 mm, 15 mm tall.