Datasheet

Data Sheet AD9119/AD9129
Rev. A | Page 7 of 68
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter Rating
DCI, DCO to VSS −0.3 V to VDD + 0.3 V
LVDS Data Inputs to VSS
−0.3 V to VDD + 0.3 V
IOUTP, IOUTN to VSSA VSSA − 0.3V to +2.5V
I250U, VREF to VSSA VSSA − 0.3 V to VDDA + 0.3 V
IRQ, CS, SCLK, SDO, SDIO, RESET,
SYNC to VSS
−0.3 V to VDD + 0.3 V
Junction Temperature 150°C
Operating Temperature Range
−40°C to +85°C
Storage Temperature Range −65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 7. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
160-Ball CSP_BGA 31.2 7.0 °C/W
1
1
With no airflow movement.
ESD CAUTION