Datasheet

AD9125
Rev. 0 | Page 7 of 56
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 6.
Parameter
With
Respect To Rating
AVDD33
AVSS, EPAD,
CVSS, DVSS
−0.3 V to +3.6 V
IOVDD
AVSS, EPAD,
CVSS, DVSS
−0.3 V to +3.6 V
DVDD18, CVDD18
AVSS, EPAD,
CVSS, DVSS
−0.3 V to +2.1 V
AVSS
EPAD, CVSS,
DVSS
−0.3 V to +0.3 V
EPAD
AVSS, CVSS,
DVSS
−0.3 V to +0.3 V
CVSS
AVSS, EPAD,
DVSS
−0.3 V to +0.3 V
DVSS
AVSS, EPAD,
CVSS
−0.3 V to +0.3 V
FSADJ, REFIO,
IOUT1P/IOUT1N,
IOUT2P/IOUT2N
AVSS −0.3 V to AVDD33 + 0.3 V
D[31:0], FRAME, DCI EPAD, DVSS −0.3 V to DVDD18 + 0.3 V
DACCLKP/DACCLKN,
REFCLKP/REFCLKN
DVSS −0.3 V to CVDD18 + 0.3 V
RESET, IRQ, CS, SCLK,
SDIO, SDO
EPAD, DVSS −0.3 V to IOVDD + 0.3 V
Junction Temperature 125°C
Storage Temperature
Range
−65°C to +150°C
The exposed paddle (EPAD) must be soldered to the ground
plane for the 72-lead LFCSP. The EPAD performs as an
electrical and thermal connection to the board.
Typical θ
JA
, θ
JB
, and θ
JC
values are specified for a 4-layer board in
still air. Airflow increases heat dissipation, effectively reducing
θ
JA
and θ
JB
.
Table 7. Thermal Resistance
Package θ
JA
θ
JB
θ
JC
Unit Conditions
72-Lead LFCSP 20.7 10.9 1.1 °C/W EPAD soldered
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.