Datasheet

AD9122
Rev. B | Page 8 of 60
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 6.
Parameter Rating
AVDD33 to AVSS, EPAD, CVSS, DVSS −0.3 V to +3.6 V
IOVDD to AVSS, EPAD, CVSS, DVSS −0.3 V to +3.6 V
DVDD18, CVDD18 to AVSS, EPAD,
CVSS, DVSS
−0.3 V to +2.1 V
AVSS to EPAD, CVSS, DVSS −0.3 V to +0.3 V
EPAD to AVSS, CVSS, DVSS −0.3 V to +0.3 V
CVSS to AVSS, EPAD, DVSS −0.3 V to +0.3 V
DVSS to AVSS, EPAD, CVSS −0.3 V to +0.3 V
FSADJ, REFIO, IOUT1P, IOUT1N,
IOUT2P, IOUT2N to AVSS
−0.3 V to AVDD33 + 0.3 V
D[15:0]P, D[15:0]N, FRAMEP, FRAMEN,
DCIP, DCIN to EPAD, DVSS
−0.3 V to DVDD18 + 0.3 V
DACCLKP, DACCLKN, REFCLKP,
REFCLKN to CVSS
−0.3 V to CVDD18 + 0.3 V
RESET, IRQ, CS, SCLK, SDIO, SDO
to EPAD, DVSS
−0.3 V to IOVDD + 0.3 V
Junction Temperature 125°C
Storage Temperature Range −65°C to +150°C
The exposed pad (EPAD) of the 72-lead LFCSP must be
soldered to the ground plane (AVSS). The EPAD provides an
electrical, thermal, and mechanical connection to the board.
Typical θ
JA
, θ
JB
, and θ
JC
values are specified for a 4-layer board in
still air. Airflow increases heat dissipation, effectively reducing
θ
JA
and θ
JB
.
Table 7. Thermal Resistance
Package θ
JA
θ
JB
θ
JC
Unit Conditions
72-Lead LFCSP 20.7 10.9 1.1 °C/W
EPAD soldered
to ground plane
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.