Datasheet

AD9122
Rev. B | Page 60 of 60
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-VNND-4
052809-A
0.20 REF
0.80 MAX
0.65 TYP
1.00
0.85
0.80
0.05 MAX
0.02 NOM
1
18
54
37
19
36
72
55
0.50
0.40
0.30
6.15
6.00 SQ
5.85
8.50 REF
EXPOSED PAD
(BOTTOM VIEW)
TOP VIEW
9.75
BSC SQ
10.00
BSC SQ
PIN 1
INDICATOR
SEATING
PLANE
12° MAX
0.60
0.42
0.24
0.60
0.42
0.24
0.30
0.23
0.18
0.50
BSC
PIN 1
INDICATOR
COPLANARITY
0.08
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 89. 72-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
10 mm × 10 mm Body, Very Thin Quad
(CP-72-7)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
AD9122BCPZ −40°C to +85°C 72-lead LFCSP_VQ CP-72-7
AD9122BCPZRL −40°C to +85°C 72-lead LFCSP_VQ CP-72-7
AD9122-M5372-EBZ Evaluation Board Connected to ADL5372 Modulator
AD9122-M5375-EBZ Evaluation Board Connected to ADL5375 Modulator
1
Z = RoHS Compliant Part.
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D08281-0-5/11(B)