Datasheet

Data Sheet AD8663/AD8667/AD8669
Rev. C | Page 13 of 16
OUTLINE DIMENSIONS
CONTROLLING DIMENSIONSARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES)
ARE ROUNDED-OFF MILLIMETER EQUIV
ALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRI
ATE FOR USE IN DESIGN.
COMPLIANT T
O JEDEC ST
ANDARDS MS-012-A
A
012407-A
0.25 (0.0098)
0.17 (0.0067)
1.27 (0.0500)
0.40 (0.0157)
0.50 (0.0196)
0.25 (0.0099)
45°
8°
0°
1.75 (0.0688)
1.35 (0.0532)
SEATING
PLANE
0.25 (0.0098)
0.10 (0.0040)
4
1
8 5
5.00
(0.1968)
4.80 (0.1890)
4.00 (0.1574)
3.80 (0.1497)
1.27 (0.0500)
BSC
6.20 (0.2441)
5.80 (0.2284)
0.51 (0.0201)
0.31 (0.0122)
COPLANARIT
Y
0.10
Figure 43. 8-Lead Small Outline Package [SOIC_N]
Narrow Body
(R-8)
Dimensions shown in millimeters and (inches)
1
EXPOSED
PAD
(BOTTOM VIEW)
0.50
BSC
PIN 1
INDICATOR
0.50
0.40
0.30
TOP
VIEW
12° MAX
0.70 MAX
0.65 TYP
0.90 MAX
0.85 NOM
0.05 MAX
0.01 NOM
0.20 REF
1.89
1.74
1.59
4
1.60
1.45
1.30
3.25
3.00 SQ
2.75
2.95
2.75 SQ
2.55
5
8
PIN 1
INDICATOR
SEATING
PLANE
0.30
0.23
0.18
0.60 MAX
0.60 MAX
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATIONS
SECTION OF THIS DATA SHEET.
04-04-2012-A
Figure 44. 8-Lead Lead Frame Chip Scale Package [LFCSP_VD]
3 mm × 3 mm Body, Very Thin, Dual Lead
(CP-8-2)
Dimensions shown in millimeters