Datasheet

AD8661/AD8662/AD8664
Rev. D | Page 7 of 16
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter Rating
Supply Voltage 18 V
Input Voltage −0.1 V to V
S
Differential Input Voltage 18 V
Output Short-Circuit Duration to GND Indefinite
Storage Temperature Range −60°C to +150°C
Operating Temperature Range
R-8, RM-8, R-14, and RU-14 −40°C to +125°C
CP-8-2 −40°C to +85°C
Junction Temperature Range −65°C to +150°C
Lead Temperature, Soldering (60 sec) 300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 6. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
8-Lead SOIC_N 121 43 °C/W
8-Lead LFCSP_VD 75
1
18
1
°C/W
8-Lead MSOP 142 44 °C/W
14-Lead SOIC_N 88.2 56.3 °C/W
14-Lead TSSOP 114 23.3 °C/W
1
Exposed pad soldered to application board.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.