Datasheet

AD8657
Rev. A | Page 21 of 24
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDA
RDS MO-187-AA
100709-B
6°
0°
0.80
0.55
0.40
4
8
1
5
0.65 BSC
0.40
0.25
1.10 MAX
3.20
3.00
2.80
COPLANARITY
0.10
0.23
0.09
3.20
3.00
2.80
5.15
4.90
4.65
PIN 1
IDENTIFIER
15° MAX
0.95
0.85
0.75
0.15
0.05
Figure 74. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
2.44
2.34
2.24
TOP VIEW
8
1
5
4
0.30
0.25
0.20
BOTTOM VIEW
PIN 1 INDEX
AREA
SEATING
PLANE
0.80
0.75
0.70
1.70
1.60
1.50
0.203 REF
0.05 MAX
0.02 NOM
0.50 BSC
EXPOSED
PAD
3.10
3.00 SQ
2.90
PIN 1
INDICATOR
(R 0.15)
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COPLANARITY
0.08
0.50
0.40
0.30
COMPLIANT
TO
JEDEC STANDARDS MO-229-WEED
01-24-2011-B
Figure 75. 8-Lead Lead Frame Chip Scale Package [LFCSP_WD]
3 mm × 3 mm Body, Very Very Thin, Dual Lead
(CP-8-11)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option Branding
AD8657ARMZ −40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 A2N
AD8657ARMZ-R7 −40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 A2N
AD8657ARMZ-RL −40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 A2N
AD8657ACPZ-R7 −40°C to +125°C 8-Lead Lead Frame Chip Scale Package [LFCSP_WD] CP-8-11 A2N
AD8657ACPZ-RL −40°C to +125°C 8-Lead Lead Frame Chip Scale Package [LFCSP_WD] CP-8-11 A2N
1
Z = RoHS Compliant Part.