Datasheet

Data Sheet AD8641/AD8642/AD8643
Rev. E | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Absolute maximum ratings apply at 25°C, unless otherwise noted.
Table 3.
Parameter Rating
Supply Voltage 27.3 V
Input Voltage VS− to VS+
Differential Input Voltage ±Supply Voltage
Output Short-Circuit Duration Indefinite
Storage Temperature Range
KS-5, R-8, RM-8, R-14, CP-16 Packages −65°C to +150°C
Operating Temperature Range −40°C to +125°C
Junction Temperature Range
KS-5, R-8, RM-8, R-14, CP-16 Packages −65°C to +150°C
Lead Temperature (Soldering, 60 sec) 300°C
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages. This
was measured using a standard 4-layer board. For the LFCSP
package, solder the exposed pad to a copper plane, which
should be connected to V+.
Table 4.
Package Type θ
JA
θ
JC
Unit
5-Lead SC70 (KS) 430 149 °C/W
8-Lead SOIC (R) 121 43 °C/W
8-Lead MSOP (RM) 142 45 °C/W
14-Lead SOIC (R) 110 36 °C/W
16-Lead LFCSP (CP) 81 16 °C/W
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION