Datasheet

AD8638/AD8639
Rev. F | Page 5 of 20
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 4.
Parameter Rating
Supply Voltage 16 V
Input Voltage GND − 0.3 V to V
SY+
+ 0.3 V
Input Current
1
±10 mA
Differential Input Voltage
2
±V
SY
Output Short-Circuit Duration to GND Indefinite
Storage Temperature Range −65°C to +150°C
Operating Temperature Range −40°C to +125°C
Junction Temperature Range −65°C to +150°C
Lead Temperature (Soldering, 60 sec) 300°C
Table 5. Thermal Resistance
Package Type θ
JA
1
θ
JC
Unit
5-Lead SOT-23 (RJ-5) 230 146 °C/W
8-Lead SOIC_N (R-8) 158 43 °C/W
8-Lead MSOP (RM-8) 206 44 °C/W
8-Lead LFCSP_WD (CP-8-5)
2
75 18 °C/W
θ
JA
is specified for the worst-case conditions, that is, a device soldered in a
he application board.
1
circuit board for surface-mount packages. This was measured using a
standard two-layer board.
2
Exposed pad is soldered to t
ESD CAUTION
1
Input pins have clamp diodes to the supply pins. Input current should be
limited to 10 mA or less whenever input signals exceed either power supply
rail by 0.3 V.
2
Inputs are protected against high differential voltages by internal 1 kΩ series
resistors and back-to-back diode-connected N-MOSFETs (with a typical V
T
of
1.25 V for V
CM
of 0 V).
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.