Datasheet

Data Sheet AD8622/AD8624
Rev. D | Page 19 of 20
2.70
2.60 SQ
2.50
COMPLIANT
TO
JEDEC STANDARDS MO-220-WGGC.
1
0.65
BSC
BOTTOM VIEWTOP VIEW
16
5
8
9
12
13
4
EXPOSED
PAD
PIN 1
INDICA
TOR
4.10
4.00 SQ
3.90
0.45
0.40
0.35
SEATING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.20 REF
0.20 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
0.35
0.30
0.25
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
SECTION OF THIS DATA SHEET.
08-16-2010-C
Figure 61. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4mm Body, Very Very Thin Quad
(CP-16-17)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-153-AB-1
061908-A
8°
0°
4.50
4.40
4.30
14
8
7
1
6.40
BSC
PIN 1
5.10
5.00
4.90
0.65 BSC
0.15
0.05
0.30
0.19
1.20
MAX
1.05
1.00
0.80
0.20
0.09
0.75
0.60
0.45
COPLANARITY
0.10
SEATING
PLANE
Figure 62. 14-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-14)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option Branding
AD8622ARMZ −40°C to +125°C 8-Lead MSOP RM-8 A1P
AD8622ARMZ-REEL −40°C to +125°C 8-Lead MSOP RM-8 A1P
AD8622ARMZ-R7 −40°C to +125°C 8-Lead MSOP RM-8 A1P
AD8622ARZ −40°C to +125°C 8-Lead SOIC_N R-8
AD8622ARZ-REEL
−40°C to +125°C
8-Lead SOIC_N
R-8
AD8622ARZ-REEL7 −40°C to +125°C 8-Lead SOIC_N R-8
AD8624ACPZ-R2 −40°C to +125°C 16-Lead LFCSP_WQ CP-16-17
AD8624ACPZ-R7 −40°C to +125°C 16-Lead LFCSP_WQ CP-16-17
AD8624ACPZ-RL −40°C to +125°C 16-Lead LFCSP_WQ CP-16-17
AD8624ARUZ −40°C to +125°C 14-Lead TSSOP RU-14
AD8624ARUZ-RL −40°C to +125°C 14-Lead TSSOP RU-14
1
Z = RoHS Compliant Part.