Datasheet

Data Sheet AD8605/AD8606/AD8608
Rev. O | Page 23 of 24
1.480
1.430
1.380
1.825
1.775
1.725
0.27
0.24
0.21
0.380
0.355
0.330
0.340
0.320
0.300
0.675
0.595
0.515
08-10-2012-A
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
SIDE VIEW
1.00
REF
0.50
BSC
BALL A1
IDENTIFIER
SEATING
PLANE
COPLANARITY
0.05
A
123
B
C
F
igure 64. 8-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-8-1)
Dimensions shown in millimeters
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS MS-012-AB
060606-A
14
8
7
1
6.20 (0.2441)
5.80 (0.2283)
4.00 (0.1575)
3.80 (0.1496)
8.75 (0.3445)
8.55 (0.3366)
1.27 (0.0500)
BSC
SEATING
PLANE
0.25 (0.0098)
0.10 (0.0039)
0.51 (0.0201)
0.31 (0.0122)
1.75 (0.0689)
1.35 (0.0531)
0.50 (0.0197)
0.25 (0.0098)
1.27 (0.0500)
0.40 (0.0157)
0.25 (0.0098)
0.17 (0.0067)
COPLANARITY
0.10
8°
0°
45°
F
igure 65. 14-Lead Standard Small Outline Package [SOIC_N]
Narrow Body (R-14)
Dimensions shown in millimeters and (inches)
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