Datasheet

AD8603/AD8607/AD8609
Rev. C | Page 14 of 16
OUTLINE DIMENSIONS
*
COMPLIANT TO JEDEC STANDARDS MO-193-AB WITH
THE EXCEPTION OF PACKAGE HEIGHT AND THICKNESS.
PIN 1
1.60 BSC
2.80 BSC
1.90
BSC
0.95 BSC
0.20
0.08
0.60
0.45
0.30
0.50
0.30
0.10 MAX
SEATING
PLANE
*
1.00 MAX
*
0.90
0.87
0.84
2.90 BSC
54
123
Figure 48. 5-Lead Thin Small Outline Transistor Package [TSOT]
(UJ-5)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-187-AA
0.80
0.60
0.40
4
8
1
5
PIN 1
0.65 BSC
SEATING
PLANE
0.38
0.22
1.10 MAX
3.20
3.00
2.80
COPLANARITY
0.10
0.23
0.08
3.20
3.00
2.80
5.15
4.90
4.65
0.15
0.00
0.95
0.85
0.75
Figure 49. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters