Datasheet

Data Sheet AD8605/AD8606/AD8608
Rev. N | Page 21 of 24
OUTLINE DIMENSIONS
02-15-2013-B
A
B
C
0.610
0.555
0.500
0.230
0.200
0.170
0.940
0.900
0.860
1.330
1.290
1.250
12
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
SIDE VIEW
0.280
0.260
0.240
0.866
REF
BALL A1
IDENTIFIER
SEATING
PLANE
0.50 BSC
COPLANARITY
0.05
0.50
BSC
Figure 58. 5-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-5-1)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-178-AA
10°
5°
0°
SEATING
PLANE
1.90
BSC
0.95 BSC
0.60
BSC
5
123
4
3.00
2.90
2.80
3.00
2.80
2.60
1.70
1.60
1.50
1.30
1.15
0.90
0
.15 MAX
0
.05 MIN
1.45 MAX
0.95 MIN
0.20 MAX
0.08 MIN
0.50 MAX
0.35 MIN
0.55
0.45
0.35
11-01-2010-A
Figure 59. 5-Lead Small Outline Transistor Package [SOT-23]
(RJ-5)
Dimensions shown in millimeters