Datasheet

AD8601/AD8602/AD8604
Rev. G | Page 5 of 24
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 3.
Parameter Rating
Supply Voltage 6 V
Input Voltage GND to V
S
Differential Input Voltage ±6 V
Storage Temperature Range −65°C to +150°C
Operating Temperature Range −40°C to +125°C
Junction Temperature Range −65°C to +150°C
Lead Temperature Range (Soldering, 60 sec) 300°C
ESD 2 kV HBM
θ
JA
is specified for worst-case conditions, that is, a device
soldered onto a circuit board for surface-mount packages using
a standard 4-layer board.
Table 4. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
5-Lead SOT-23 (RJ) 190 92 °C/W
8-Lead SOIC (R) 120 45 °C/W
8-Lead MSOP (RM) 142 45 °C/W
14-Lead SOIC (R) 115 36 °C/W
14-Lead TSSOP (RU) 112 35 °C/W
16-Lead QSOP (RQ) 115 36 °C/W
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION