Datasheet
–3–
REV. 0
AD8582
WARNING!
ESD SENSITIVE DEVICE
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD8582 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
ABSOLUTE MAXIMUM RATINGS*
V
DD
to DGND & AGND . . . . . . . . . . . . . . . . . . . –0.3 V, +7 V
Logic Inputs to DGND . . . . . . . . . . . . . . .–0.3 V, V
DD
+ 0.3 V
V
OUT
to AGND . . . . . . . . . . . . . . . . . . . . .–0.3 V, V
DD
+ 0.3 V
V
REF
to AGND . . . . . . . . . . . . . . . . . . . . .–0.3 V, V
DD
+ 0.3 V
AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, V
DD
I
OUT
Short Circuit to GND . . . . . . . . . . . . . . . . . . . . . . 50 mA
Package Power Dissipation . . . . . . . . . . . . . . .(T
J
max–T
A
)/θ
JA
Thermal Resistance, θ
JA
24-Pin Plastic DIP Package (N-24) . . . . . . . . . . . . . 62°C/W
24-Lead SOIC Package (SOL-24) . . . . . . . . . . . . . . 73°C/W
Maximum Junction Temperature (T
J
max) . . . . . . . . . . 150°C
Operating Temperature Range . . . . . . . . . . . . .–40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . .–65°C to +150°C
Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . . . +300°C
*Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in the
operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PIN DESCRIPTION
Pin No. Name Description
1, 24 V
OUTA
Voltage outputs from the DACs. Fixed
V
OUTB
output voltage range of 0 V to 4.095 V
with 1 mV/LSB. An internal
temperature stabilized reference
maintains a fixed full-scale voltage
independent of time, temperature and
power supply variations.
2 AGND Analog Ground. Ground reference for
the internal bandgap reference voltage,
the DAC, and the output buffer.
3 DGND Digital ground for input logic.
4, 21
LDA, Load DAC register strobes. Transfers
LDB input register data to the DAC registers.
Active low inputs, Level sensitive latch.
May be connected together to double-
buffer load DAC registers.
5 MSB Digital Input: High presets DAC
registers to half scale (800
H
), Low
clears DAC registers to zero (000
H
)
upon
RST assertion.
6
RST Active low digital input that clears the
DAC register to zero, setting the DAC
to minimum scale when MSB pin = 0,
or half-scale when MSB pin = 1.
7–18 DB
0–11
Twelve Binary Data Bit Inputs. DB11 is
the MSB and DB0 is the LSB.
19
CS Chip Select. Active low input.
20
A/B Select DAC A = 0 or DAC B = 1.
22 V
DD
Positive Supply. Nominal value +5 V, ±5%.
23 V
REF
Nominal 2.5 V reference output
voltage. This node must be buffered if
required to drive external loads.
PIN CONFIGURATIONS
N-24
24-Pin Plastic DIP
SOL-24
24-Pin SOIC
V
OUTA
AGND
V
OUTB
V
REF
MSB
DB0 DB11
DGND V
DD
DB1 DB10
DB2 DB9
DB3 DB8
DB4 DB7
DB5 DB6
14
1
2
24
23
5
6
7
20
19
18
3
4
22
21
8
17
9
16
10
15
11
TOP VIEW
(Not to Scale)
12
13
AD8582
LDA
RST
LDB
CS
A/B
TOP VIEW
(Not to Scale)
12
13
AD8582
1
24
LDA, LDB
CS
A/B
D0–D11
RST
t
AS
t
AH
t
DS
t
DH
t
LDW
t
RSW
t
LS
t
LH
V
OUT
t
S
t
S
± 1LSB
ERROR BAND
t
CSW
Timing Diagram
ORDERING INFORMATION*
Temperature Package Package
Model Range Description Option
AD8582AN –40°C to +85°C 24-Pin Plastic DIP N-24
AD8582AR –40°C to +85°C 24-Lead SOIC SOL-24
AD8582Chips +25°C Die
*For die specifications contact your local Analog Devices sales office. The
AD8582 contains 1270 transistors.