Datasheet

AD8557
Rev. C | Page 21 of 24
OUTLINE DIMENSIONS
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS MS-012-AA
012407-A
0.25 (0.0098)
0.17 (0.0067)
1.27 (0.0500)
0.40 (0.0157)
0.50 (0.0196)
0.25 (0.0099)
45°
8°
0°
1.75 (0.0688)
1.35 (0.0532)
SEATING
PLANE
0.25 (0.0098)
0.10 (0.0040)
4
1
8 5
5.00 (0.1968)
4.80 (0.1890)
4.00 (0.1574)
3.80 (0.1497)
1.27 (0.0500)
BSC
6.20 (0.2441)
5.80 (0.2284)
0.51 (0.0201)
0.31 (0.0122)
COPLANARITY
0.10
Figure 48. 8-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(R-8)
Dimensions shown in millimeters and (inches)
16
5
13
8
9
12
1
4
1.95 BSC
PIN 1
INDICATOR
TOP
VIEW
4.00
BSC SQ
3.75
BSC SQ
COPLANARITY
0.08
EXPOSED
PAD
(BOTTOM VIEW)
COMPLIANT TO JEDEC STANDARDS MO-220-VGGC
12° MAX
1.00
0.85
0.80
SEATING
PLANE
0.35
0.30
0.25
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
0.20 REF
0.65 BSC
0.60 MAX
0.60 MAX
P
IN 1
INDICATOR
0.50
0.40
0.30
0.25 MIN
2.50
2.35 SQ
2.20
082008-A
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 49. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-16-10)
Dimensions shown in millimeters